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Type    CPU / Microprocessor
Frequency (MHz)       266
Bus speed (MHz)       33
Clock multiplier       8
Package    320-pin Ceramic Staggered Pin Grid Array
1.952″ x 1.952″ (4.96 cm x 4.96 cm)
Architecture / Microarchitecture
Manufacturing process    0.35 micron 4-layer metal CMOS process
Data width    32 bit
Floating Point Unit    Integrated
Level 1 cache size       16 KB write-back 4-way set associative unified instruction and
data cache
Physical memory (GB)    1
Features    MMX multimedia instructions
Low power features
APM support
CPU only suspend
Suspend modulation
Full 3V suspend
On-chip peripherals
PCI controller
Display controller and 2D Graphics accelerator
64-bit synchronous DRAM controller
Memory Management Unit
Internal Bus Interface Unit
Electrical/Thermal parameters
V core (V)      2.9 ± 0.15
V I/O or secondary (V)    3.3 ± 0.16
Minimum/Typical/Maximum power dissipation (W)    3.26 (Suspend mode) / 5.87 / 10.7
Notes
Interfaces with Cx5520 or Cx5530 companion chips